Design Architecture Smart Heatsink Laptop untuk Mengatasi Overheat dan Korslet Motherboard
Abstract
Technological developments, especially in the field of computer architecture, are growing very rapidly. The role of cooling is a major factor in reducing the risk of damage that generally occurs, such as overheating and short circuits. Overheating on a laptop can cause the laptop to shut down and slow performance. The cause of overheating is due to air blockages in the heatsink fins so that hot air from the processor cannot escape from the laptop. Heatsink fins that are still static provide access for dust to enter and exit, causing blockages. Dynamic Smart Heatsink architecture can open and close automatically so that the laptop can be protected from external interference such as dust and animals.
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References
Burg, D., & Ausubel, J. H. (2021). Moore’s Law revisited through Intel chip density. PLoS ONE, 16(8 August). https://doi.org/10.1371/journal.pone.0256245
Fábregas, J., Santamaría, H., Buelvas, E., Saulpérez, Díaz, C., Carpintero, J., Mendoza, R., & Villa, J. (2022). COMPUTATIONAL FLUID DYNAMICS MODELING OF MICROCHANNELS COOLING FOR ELECTRONIC MICRODEVICES. IIUM Engineering Journal, 23(1), 384–396. https://doi.org/10.31436/IIUMEJ.V23I1.2113
Fazza, F. El. (2022). Analisis Komparatif Tombol Power Keyboard Dan Tombol Power Motherboard Pada Laptop. Jurnal Dinamika Informatika, 11(1), 25–33.
Gayathri Prasad, P., Prasad Chilamkurti, L. V. R. S. V., & Santarao, K. (2020). Investigation to Enhance the Performance of Computer Processor Cooling System. IOP Conference Series: Materials Science and Engineering, 954(1). https://doi.org/10.1088/1757-899X/954/1/012022
Shanmuganathan, M., Sandeep Kumar, S., Hosanna Princye, P., Aravind, A. R., Chhabria, S., & Jyothirmayee, C. A. (2022). Improving the cooling performance of the straight finned heat sink (SHS) for computer processor using an inorganic PCM. Materials Today: Proceedings, 69, 749–753. https://doi.org/10.1016/j.matpr.2022.07.156
Topcu, G., Ercetin, U., & Timuralp, C. (2023). CFD Analysis of Liquid-Cooled Heatsink Using Nanofluids in Computer Processors. Scientia Iranica, 0(0), 0–0. https://doi.org/10.24200/sci.2023.60327.6739
Wiriyasart, S., Hommalee, C., & Naphon, P. (2019). Thermal cooling enhancement of dual processors computer with thermoelectric air cooler module. Case Studies in Thermal Engineering, 14. https://doi.org/10.1016/j.csite.2019.100445
Xu, X. (2021). Material database management system based on heterogeneous multi-processor and computer embedded system. Microprocessors and Microsystems, 82. https://doi.org/10.1016/j.micpro.2021.103926
Fábregas, J., Santamaría, H., Buelvas, E., Saulpérez, Díaz, C., Carpintero, J., Mendoza, R., & Villa, J. (2022). COMPUTATIONAL FLUID DYNAMICS MODELING OF MICROCHANNELS COOLING FOR ELECTRONIC MICRODEVICES. IIUM Engineering Journal, 23(1), 384–396. https://doi.org/10.31436/IIUMEJ.V23I1.2113
Fazza, F. El. (2022). Analisis Komparatif Tombol Power Keyboard Dan Tombol Power Motherboard Pada Laptop. Jurnal Dinamika Informatika, 11(1), 25–33.
Gayathri Prasad, P., Prasad Chilamkurti, L. V. R. S. V., & Santarao, K. (2020). Investigation to Enhance the Performance of Computer Processor Cooling System. IOP Conference Series: Materials Science and Engineering, 954(1). https://doi.org/10.1088/1757-899X/954/1/012022
Shanmuganathan, M., Sandeep Kumar, S., Hosanna Princye, P., Aravind, A. R., Chhabria, S., & Jyothirmayee, C. A. (2022). Improving the cooling performance of the straight finned heat sink (SHS) for computer processor using an inorganic PCM. Materials Today: Proceedings, 69, 749–753. https://doi.org/10.1016/j.matpr.2022.07.156
Topcu, G., Ercetin, U., & Timuralp, C. (2023). CFD Analysis of Liquid-Cooled Heatsink Using Nanofluids in Computer Processors. Scientia Iranica, 0(0), 0–0. https://doi.org/10.24200/sci.2023.60327.6739
Wiriyasart, S., Hommalee, C., & Naphon, P. (2019). Thermal cooling enhancement of dual processors computer with thermoelectric air cooler module. Case Studies in Thermal Engineering, 14. https://doi.org/10.1016/j.csite.2019.100445
Xu, X. (2021). Material database management system based on heterogeneous multi-processor and computer embedded system. Microprocessors and Microsystems, 82. https://doi.org/10.1016/j.micpro.2021.103926
Published
2024-10-06
How to Cite
el fazza fahri. (2024). Design Architecture Smart Heatsink Laptop untuk Mengatasi Overheat dan Korslet Motherboard . Jurnal Ilmiah Sistem Informasi Dan Teknik Informatika (JISTI), 7(2), 253-260. https://doi.org/10.57093/jisti.v7i2.223
Section
Articles
JISTI
